Surface roughness induced by plasma etching of si-containing polymers

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Technological Educational Institute of Athens
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2003 (EN)
Surface roughness induced by plasma etching of si-containing polymers (EN)

Τσερέπη, Αγγελική Δ. (EL)
Γογγολίδης, Ευάγγελος (EL)
Κωνσταντούδης, Βασίλειος (EL)
Κορδογιάννης, Γεώργιος (EL)
Ράπτης, Ιωάννης Α. (EL)

Βαλαμόντες, Ευάγγελος Σ. (EL)
N/A (EN)

Interfacial properties of polymers and their control become important at submicrometer scales, as polymers find widespread applications in industries ranging from micro- and nano-electronics to optoelectronics and others fields. In this work, we address the issue of controlled modification of surface topography of Si-containing polymers when subjected to oxygen-based plasma treatments. Treated surfaces were examined by atomic force microscopy to obtain surface topography and roughness of plasma-treated surfaces. Our experimental results indicate that an appropriate optimization of plasma chemistry and processing conditions allows, on one hand, small values of surface roughness, a result crucial for the potential use of these polymers for sub-100 nm lithography, and, on the other hand, desirable topography, applicable for example in sensor devices. Plasma processing conditions can be modified to result either in smooth surfaces (rms roughness < 1 nm) or in periodic structures of controlled roughness size and periodicity. (EN)


Plasma treatment (EN)
Bilayer resists (EN)
Πολυμερή που περιέχουν πυρίτιο (EN)
Silicon-containing polymers (EN)
Surface roughness (EN)
Ανθεκτική Διστοιβάδα (EN)
Επιφανειακή τραχύτητα (EN)
Επεξεργασία πλάσματος (EN)

ΤΕΙ Αθήνας (EL)
Technological Educational Institute of Athens (EN)

Journal of Adhesion Science and Technology (EN)



DOI: 10.1163/156856103322113805

Taylor & Francis (EN)

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