Photoelastic study of a crack approaching the bonded half-plates interface

 
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Journal part (EN)
Scientific article (EN)
1989 (EN)
Photoelastic study of a crack approaching the bonded half-plates interface (EN)
Theotokoglou, EN (EN)
Tsamasphyros, GJ (EN)
Spyropoulos, CP (EN)
A photoelastic analysis of a crack approaching the free boundary of a half-plate or the interface of bonded plates is presented. It is based on the numerical approximation of the exact stress fields obtained by the method of singular integral equations. The stress intensity factors at the crack tips or the applied stresses at infinity are experimentally determined using photoelastic measurements. This is effected either by using the proposed numerical procedure or directly through the use of concise nomograms. Numerical results and simulated isochromatic fringe patterns are presented for a straight crack perpendicular to the interface only. © 1989. (EN)
journalArticle (EN)
Cracks Photoelastic Study (EN)
Cauchy Type Singularity (EN)
Mechanics (EN)
Mathematical Techniques--Integral Equations (EN)
Photoelasticity (EN)
Simulated Isochromatic Fringe Patterns (EN)
Stresses--Analysis (EN)
Bonded Half-Plates Interface (EN)
Stress Intensity Factors (EN)
Plates (EN)
National Technical University of Athens
Digital Library of National Technical University of Athens | Dspace@NTUA
Κεντρική Βιβλιοθήκη Ε.Μ.Π.
Ιδρυματικό Αποθετήριο
Δημοσιεύσεις μελών Δ.Ε.Π. σε περιοδικά
Engineering Fracture Mechanics (EN)
English
1989 (EN)
http://hdl.handle.net/123456789/10073
10.1016/0013-7944(89)90240-3 (EN)
34 (EN)
1 (EN)
0013-7944 (EN)
31 (EN)
42 (EN)
ISI:A1989AQ60300003 (EN)
PERGAMON-ELSEVIER SCIENCE LTD (EN)



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