Molecular weight and processing effects on the dissolution properties of thin poly(methyl methacrylate) films

 
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2008 (EN)
Molecular weight and processing effects on the dissolution properties of thin poly(methyl methacrylate) films (EN)

Βαλαμόντες, Ευάγγελος Σ. (EL)
Μπέλτσιος, Κωνσταντίνος Γ. (EL)
Γουστουρίδης, Δημήτριος (EL)
Γκανέτσος, Θεόδωρος (EL)
Κοκκίνης, Α. (EL)

Ράπτης, Ιωάννης Α. (EL)
N/A (EN)

An experimental set-up based on multiwavelength interferometry, is applied in order to study in-situ the dissolution process of thin resist films. The interference function was the basis for a fitting algorithm, which analyses the experimental data and evaluates the progress of the resist thickness with time. The dissolution of various PMMA molecular weights (15 K, 350 K, 996 K) and resist thicknesses (20-300 nm), in various developers, consisting of mixtures of methyl iso butyl ketone (MIBK), iso propanol (IPA), H2O at various relative concentrations, was studied. Surface dissolution inhibition was shown in unexposed resists with high molecular weights and increased thickness in the case of MIBK-IPA 1-1 and IPA-H2O 7-3 developers. After that the whole dissolution process evolved at a steady rate. Dissolution of thick films proved to be unpredictable showing complex dissolution curves. Low molecular weight resists presented a smooth dissolution curve without dissolution inhibition. Samples exposed with small DUV doses, exhibited dissolution behavior similar to the unexposed cases, whereas high exposure doses, within the lithographically useful range, led to smooth dissolution behavior. In the case of MIBK-IPA 1-3 developer significant swelling was observed. (EN)

journalArticle

Διάλυση (EN)
Lithography (EN)
Λιθογραφία (EN)
Poly(methyl methacrylate) (EN)
Multiwavelength interferometry (EN)
Dissolution (EN)
Λεπτό φιλμ (EN)
Thin film (EN)

ΤΕΙ Αθήνας (EL)
Technological Educational Institute of Athens (EN)

Microelectronic Engineering (EN)

English

2008-01

DOI: 10.1016/j.mee.2007.04.141

Elsevier (EN)



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