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2008 (EN)
Aqueous base developable (EN)

Σπηλιώτης, Αθανάσιος (EL)
Βαλαμόντες, Ευάγγελος Σ. (EL)
Γουστουρίδης, Δημήτριος (EL)
Χατζηχρηστίδη, Μαργαρίτα (EL)
Rajta, István (EN)

Αργείτης, Παναγιώτης (EL)
Ράπτης, Ιωάννης Α. (EL)
N/A (EN)

A variety of different photo resists are used for the fabrication of polymer and metal high aspect ratio structures. Among them SU-8, a chemically amplified negative tone photoresist is the mostly used. However, after processing the finished resist pattern (SU-8) is hardly removed from the substrate. In the present work the formulation and process optimization of a negative tone chemically amplified photoresist (TADEP) is presented. TADEP resist owns two advantages: the dissolution of the uncrosslinked areas in IC standard aqueous developers and the easy stripping in acetone by the assistance of ultrasonic bath. The TADEP resist is successfully applied for the fabrication of polymer and metal structures, after electroplating and stripping and also in the case of Proton Beam Writing. (EN)


Διάλυση (EN)
Αναλογία διαστάσεων (EN)
Ακετόνη (EN)
Ανάκτηση μετάλλων (EN)
Metal recovery (EN)
Aspect ratio (EN)
Electroplating (EN)
Βελτιστοποίηση (EN)
Dissolution (EN)
Optimization (EN)
Acetone (EN)

ΤΕΙ Αθήνας (EL)
Technological Educational Institute of Athens (EN)

Microsystem Technologies (EN)



DOI 10.1007/s00542-008-0571-x

Springer Verlag (EN)

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