Truly low temperature sintering of printed copper ink using formic acid

 
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Journal part (EN)
Scientific article (EN)
2018 (EN)
Truly low temperature sintering of printed copper ink using formic acid
Ligorio, Giovanni
Pozov, Sergey M.
Ward, Richard
Choulis, Stelios A.
Hermerschmidt, Felix
List-Kratochvil, Emil J. W.
Burmeister, David
Article
Low temperature sintering
Low cost flexible substrates
Inkjet-printed electronics
Copper nanoparticle ink
High conductivity
Cyprus University of Technology
Ktisis
Cyprus University of Technology Repository
Άρθρα/Articles
English
2018-12
Advanced Materials Technologies, 2018, vol. 3, no.12
2365-709X
10.1002/admt.201800146
2019-03-31T18:21:12Z
© WILEY



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