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Low-power interconnect for implant SoC (EN)

Λυράκης, Αλέξιος (EL)
Lyrakis, Alexios (EN)

Οικονομάκος, Γεώργιος (EL)
ntua (EL)
Σούντρης, Δημήτριος (EL)
Πεκμεστζή, Κιαμάλ (EL)

bachelorThesis

2017-02-13T10:44:50Z
2017-02-13
2016-09-26


Implanted medical devices (IMDs) are safety-critical devices that are currently used for the long-treatment of various medical conditions such as cardiac arrhythmias, Parkinson's disease and epilepsy. Modern IMDs employ a wide range of components (sensors, actuators, processors and memory blocks) which communicate with each other in a System-On-Chip (SoC) architecture. The design of IMDs is a challenging task because of the low-power and size constraints; however, little attention has been given so far to the design of the interconnect between the various components. Given the increasing complexity of IMD SoCs, the choice of the communication architecture can play a significant role in the total device's power consumption and size. The purpose of this thesis is to examine different communication architectures regarding their use for IMDs. After considering a range of interconnects and their use for IMDs, we designed and implemented a crossbar and point-to-point interconnect in VHDL and synthesized the designs in UMC 90nm technology. These designs were subsequently evaluated and compared in terms of throughput, latency, size and power consumption. Our results proved that the point-to-point may outperform the crossbar, but the crossbar has a significant lower power consumption than the point-to-point. Consequently, based on IMDs needs for ultra-low power consumption, crossbar should be preferred for implantable medical applications. (EN)


Point-To-Point (EN)
IMD (EN)
VHDL (EN)
ASIC (EN)
Crossbar (EN)

Greek
English

Εθνικό Μετσόβιο Πολυτεχνείο. Σχολή Ηλεκτρολόγων Μηχανικών και Μηχανικών Υπολογιστών (EL)

Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ελλάδα
http://creativecommons.org/licenses/by-nc-nd/3.0/gr/




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